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Future Smartphones will See Through Walls and other Solid objects

17 June, 2012 Technology

BETA test Smartphone

 

Scientists from the University of Texas are on the verge of developing a mobile technology capable to see through walls and other solid objects. The technology combines the capturing of an unused "TERAHERTZ" range in the electromagnetic spectrum with a a new microchip capable of reproducing the data.


Thanks to the direct tapping in the terahertz range the future sensors will be much more simple than similar technology used nowadays, as it won't need the use of several lenses inside a device.


TERAHERTZ Rays


The new chip is based on the popular CMOS (Complementary Metal-Oxide Semiconductor) technology, but when combined with terahertz waves it becomes possible for the sensor to capture images behind solid objects like walls and bodies.


The technology is very powerful as it offers limitless uses in construction, medicine, archaeology, document and money authentication and many more fields. The simplicity of the technology also makes it usable in mobile devices, which adds an interesting privacy concern to the matter.

 

 

 


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