Samsung Electronics is about to unveil another flagship smartphone from the S lineup called Samsung Galaxy S7. A few months ago, there were rumours around Snapdragon 820 when Qualcomm was about to reveal the complete specification of the chipset and it was said there was overheating problem. With this, Qualcomm quickly discarded these rumors and assured that the Snapdragon 820's heating is under the permissible limit..

But it seems that might not be the case. As per new rumors, it has been shown that Samsung is actually looking for internal heat pipe suppliers for their 2016 flagship smartphone. Heat pipes in smartphones have become a common part. We have also seen other OEMs like Sony use heat pipes in their Xperia Z5 variants, so the it shouldn't come as surprise in case Samsung also decides to take the same route.

It can't be said for sure if this is more of a preventive measure to save the phone from any kind of heating problem or result of using the Snapdragon 820 (as it facing heating issues). We'd like to consider that whatever issue the Snapdragon 810 had, Qualcomm has resolved that in the new 820 variant. But in order to get the complete picture we need wait till the release of the device.

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The Snapdragon 815 is coming this year, We have heard a lot of things about hot Snapdragon 810 chipset and its alleged overheating issues. We still don't know the whole outcome of the story as there are almost no real tests that show if the Snapdragon 810 processor really suffers from overheating.

However, there are several reports, especially the recent HTC One M9 overheating issues, that showed high operating temperatures. The issues seems to be fixed with the upcoming Snapdragon 815, which runs at 100.4 degrees (38° C), compared to the 107.6 (42° C) degrees by the Snapdragon 801, 111.2 (44° C) degrees by the Snapdragon 810. Since there isno real test of the Snapdragon 810, and the Snapdragon 815 is still far away from production.

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