We are pretty much used to seeing Qualcomm manufacturing the flagship grade 8xx series of Snapdragon processors every year for a while now, but rumors are indicating that this scenario could change in 2017. Samsung might just be exclusively manufacturing the upcoming SD 830 SoC for Qualcomm next year. The same rumor also reported that this new chip would be based on a 10nm FoFLP process, which is a new cooperative venture by Samsung and Qualcomm. This new Fan-out Panel Level Package (FoFLP) process will make printed circuit boards unnecessary for the package substrate. The advantages will include better battery life and thinner frames along with making I/O ports much easier to put in.
Allegedly, Samsung will continue to produce its own brand of Exynos processors as well and the upcoming Galaxy S8 will be launched in the same way as it had been done this year. This means that the international version of the S8 will sport the Exynos 8895 SoC, while the US versions will come with SD 830. However, the performance and battery life of the two variants should not differ by much next year, if both chips are made by Samsung on a 10nm process.
Saikat Kar (tech-enthusiast)