Reports that the new Snapdragon 810 chipset has been contending with heating problems has not stopped all OEMs from getting on board with the new Octa-core 64-bit silicon.
LG was the first manufacturer to announce it would be using the new system-on-a-chip in the new LG G Flex 2. The company said it was able to work around the chip's heat emissions. While that is arguably a good sign, it could also be seen as an acknowledgment that the Snapdragon 810 runs hotter than some would prefer.
The issue has been the source of reports that Samsung was forgoing use of the new Qualcomm chip, in favor of its own Exynos CPU for the next generation Galaxy flagship "Galaxy S6". However, it looks like Qualcomm is working on a redesign to address the heat emission issue and should have a solution for Samsung by March.
It is not known if that will be in time for Samsung's plans for manufacturing its new line of devices in 2015, but Qualcomm is undaunted since the Snapdragon 810 is obviously an integral part of the chipmaker's strategy.
For its part, LG has stated that heat levels are not solely about the CPU, but how a device is also designed to dissipate that heat. The company noted that the G Flex 2 was designed with the Snapdragon 810 in mind, so heat levels have remained within what LG deems optimal.
LG brought out what will certainly be one of the most innovative products at the CES 2015, the curved LG G Flex2. It's more compact and more powerful than its predecessor, more curved and heals faster.
Starting off with the display, LG's homemade P-OLED tech has improved over the last year and the new screen has 1080p resolution (up from just 720p). Meanwhile the screen diagonal has shrunken a bit to the more manageable 5.5" (down from 6").
The screen is protected by an LG-developed glass cover that is said to be 20% more durable than Gorilla Glass 3. The back has a special self-healing coating LG marked a massive improvement by cutting the heal time from 3 minutes to just 10 seconds at room temperature. Check the video below to see it in live action.
Anyway, the LG G Flex2 will be the most powerful device for a while it will be the first to bring Snapdragon 810 in consumer hands and it only renders at 1080p (not QHD!). The phone will launch with Android 5.0 Lollipop and 2GB RAM. For storage there's 16GB or 32GB, plus a microSD card.
At the MWC 2015, HTC has just officially announced its 2015 flagship, HTC One M9, with a new refined design that features a Dual-tone Metal Unibody, scratch-resistant coating and sapphire glass on the camera lens.
HTC One M9 comes with refined design with less part count, dual anodization, and scratch-resistant coating and sapphire glass on the camera lens. While it looks a lot like the One (M8), the new One M9 design is more minimalistic and the smartphone is lighter and smaller. It has a single-part front bezel, new placement for the Power/Lock key, an improved volume rocker, and brand new color options.
HTC One M9 packs a 5" 1080p display the same unit from One (M8) Super LCD3 with minor improvements on the technology and color rendering. The highlight of the front are the traditional BoomSound stereo speakers, now improved further by 5.1 Dolby surround Sound.
The One M9 is powered by the latest Qualcomm Snapdragon 810 platform - an octa-core 64-bit processor with four Cortex-A57 cores at 2.0GHz and four Cortex-A53 working at 1.5GHz. The new Adreno 430 is responsible for the graphics, while the 3GB RAM will help with the multi-tasking.
HTC One M9 runs on Android 5.0 Lollipop enhanced with the new HTC Sense 7 UI. HTC Blinkfeed is a major part of the new Sense and now content from the aggregator will be displayed on the lockscreen as well. The updated service also uses location specific suggestions, thanks to a new partnership with Yelp, and will be able to gives you various tips for nearby restaurants.
The entire concept of HTC Sense has changed and now the launcher supports themes, which will be able to change its looks completely backgrounds, colors, icons, even the keyboard. There will be a theme generator, which will support automatic theme generation by inputting just a single image.
Despite the fact that the Snapdragon 810 SoC was officially announced several months ago, the chipset at hand is not expected to become commercially available before 2015. Until that moment comes however, Qualcomm has plenty of time to further tweak and improve its SoC, and judging by the latest happenings it appears that the SD 810 is already undergoing testing.
A new test machine that seems to draw its processing power from the Snapdragon 810 popped-up in AnTuTu database, revealing some of the chipset's characteristics.
Today, Jon Carvill, Senior Director of Public Relations at the California-based semiconductor corporation, cleared the smoke and assured everybody that the Snapdragon 810 will arrive as scheduled without problems. Carvill diplomatically refused to comment on the speculations themselves, but had this to say about the future of their upcoming chipset:
"I can tell you that everything with Snapdragon 810 remains on track and we expect commercial devices to be available in 1H 2015"
This of course is great news for OEMs and eager consumers waiting to get their hands on the next wave of flagship devices, powered by the 20nm, 64-bit Qualcomm chip. With Snapdragon 810 reference devices already available it seems likely that we are set to see the first consumer devices out in the open mid 2015.
Qualcomm Snapdragon 810 is the top-notch chipset to date, expected to premiere on various flagships early next year on CES and MWC expos. It will offer an octa-core 64-bit processor, new Adreno 430 GPU and brand new Qualcomm modem.
The initial announcement specified the LTE support as Cat 6, which translates into 300 Mbps downlink and 50 Mbps uplink. The LTE race has been rapidly advancing since and Samsung is already rumored to be prepping an LTE Cat 10-enabled Exynos chipset for the Galaxy S6.
Qualcomm has previously confirmed it will be adding LTE Cat 9 capable modem for the Snapdragon 810 chipset and it will eventually make it to all Qualcomm flagships in 2015. The testing process is now happening in the UK, with the help of Huawei and the EE network. This means EE will be among the first carriers to upgrade its network with the latest LTE tech.
LTE Cat 9 stands for 450 Mbps download and up to 50 Mbps upload. The alleged Exynos 6 Samsung chipset with Cat 10 will offer the same downlink, but the uplink is doubled at up to 100 Mbps.
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According to a source, the Snapdragon 810 will be driving the LG G4. As we recently noted, overheating issues with the chip are leading smartphone manufacturers to consider other options. Samsung is reportedly going to stuff up to 90% of its initial production of the Samsung Galaxy S6 with its own Exynos chipset. LG does have its NUCLUN octa-core processor, but it apparently is not up to snuff. As a result, Qualcomm's chip is still expected inside the LG G4.
Besides carrying 3GB RAM, a dump of Android 5.0 has brought forth evidence of 5312 × 2988 resolution pictures that will be available from the LG G4. That leads to speculation that the device will feature a 16MP wide-lens rear camera, which would be a nice bump from the 13MP rear camera on the LG G3.
We will soon see the LG G4 unwrapped next March at MWC in Barcelona.
Samsung has just officially announced a New variant of the Galaxy Note 4 in South Korea. This new model is called Galaxy Note 4 S-LTE with model number SM-916, it will hit the shelves in its homeland in mid-January.
Samsung Galaxy Note 4 S-LTE packs a 64-bit Qualcomm Snapdragon 810 chipset. The rest of the device's specs is the same as the Original Note 4. The new model (LTE Cat.9) will be capable of offering download speeds of up to 300Mbps via carrier aggregation. In theory, the speeds can reach up to 450Mbps.
Samsung Galaxy Note 4 S-LTE will be available on all major carriers in South Korea. There is no word on availability outside the country for the time being.